World best super precision full 3D AOI

- Non-blind spot digital 8 projection moiré 3D inspection technology
- Inspection for diffused reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting
- Smallest component inspection by 25Megapixel 7.7㎛ CXP main camera
- High resolution 18 mega pixel angled camera system

Hybrid Inspection: Best yield with combination of full 3D inspeciton, full 2D insepction and deep learning algorithm

Multi-Vision® : simultaneous 5-dimension inspeciton by using 18 mega pixel angled cameras

Intellisys® : Total process management system for improving productivity and achieving smart factory

One-Click Programming : simple and easy programming by using IPC international standard library

Powerful 3D AOI which can be applied to SMT production line and second process of semiconductor manufacturing