(1), the SOP (Small outline Package) : parts on both sides have feet, foot outward open (usually called the gull wing type of pin).

(2), SOJ (Small outline J - lead Package) : parts on both sides, with feet at the bottom of the feet to the parts bending (J type pin).

(3), QFP (Quad Flat Package) : parts has feet, foot outward open parts.

(4), PLCC (Plastic Leadless Chip Carrier) : parts has feet, bending part at the bottom of the feet to the parts.

(5), BGA (Ball Grid Array) : parts surface without feet, the foot, globular matrix is arranged on the bottom of the parts.

(6), the CSP (CHIP SCAL PACKAGE) : packaging component size